67th Annual SVC Technical Conference • May 6 - 9, 2024

Education Program • May 4 - 9 | Technology Exhibit • May 7 - 8

Plasma Processing & Diagnostics

Plasma has the unique capability of providing a diverse and complex environment that has proven to be well suited for a wide variety of industrial applications, including physical vapor deposition (PVD) and plasma enhanced chemical vapor deposition (PECVD) of thin films and coatings anisotropic dry etching, and surface chemical modification. More recently, the plasma processing community is exploring exciting new opportunities involving atmospheric pressure discharges, microplasmas, pulsed plasmas and plasma interactions with liquids and living tissues.

The full potential of plasma processing on an industrial scale can only be realized when basic material processing studies are accompanied by the understanding of plasma physics, plasma chemistry and the underlying mechanisms at the plasma-surface interface, developed through both modeling and experimental efforts. 

Accordingly, the plasma processing chairs welcome papers of a fundamental and applied nature in the following topics:

  • Plasma diagnostics (optical, electrical, particle) of PVD, PECVD, and other plasma-enabled processes as a bridge between the plasma environment and material properties.
  • Plasma modeling as a tool for simulation-driven design/optimization of novel plasma sources and plasma processes.
  • Innovative PVD techniques, state of the art PECVD, and other plasma enhanced approaches to the production of advanced thin films and coatings.
  • Reactive Ion Etching (RIE), nanopatterning, plasma nitriding/carburizing and other techniques of plasma surface modification and functionalization.
  • Atmospheric pressure plasmas for thin film deposition and surface functionalization.
  • Disruptive plasma applications such as plasma catalysis, gas conversion, nanostructure growth or liquid treatment.
  • Technological challenges in the implementation of plasma-based techniques for next-generation industrial applications.

Plasma Processing TAC Co-Chairs: Adam Obrusnik, PlasmaSolve, obrusnik@plasmasolve.comOleg Zabeida, Polytechnique Montreal, oleg.zabeida@polymtl.caAssistant TAC Chairs: Lenka Zajickova, Central European Institute of Technology & Masaryk University, Czech Republic, lenkaz@physics.muni.czCraig A. Outten, Universal Display Corporation, coutten@verizon.net