Atomic Layer Processing

Over the last few years, atomic layer processes (ALPs), such as atomic layer deposition (ALD) atomic layer etching (ALEt), molecular layer deposition (MLD), and atomic layer epitaxy (ALEp) have increased in importance, enabling many new products and applications. With excellent uniformity, nanoscale precision and high versatility, ALPs are finding applications in sensing, optical coatings, energy storage, and microelectronics. Recent advances in low temperature processing makes ALP methods attractive to the processing of polymers, biomaterials, and other applications with low thermal budgets. 

We are soliciting oral or poster contributions to the ALP session in areas including both established ALP technologies and creative new developments in ALP technologies. Advanced ALP technologies which successfully cross over from early‐stage feasibility studies into commercially viable industrial solutions are also of interest. 

Topics of this session will include:

  • Fundamental aspects of atomic layer processing (ALP)
  • Plasma-enhanced processes
  • Challenges and applications of ALPs
  • Novel concepts and technologies for ALP process control, monitoring and thin-film characterization
  • Modelling of ALPs and ab-initio calculations enabling their design and understanding
  • Innovations in methods and progress in up-scaling of ALPs towards high-volume industrial applications
  • Creative new business concepts or market perspectives that accelerate transfer of ALP technologies from lab-scale to commercial viability

Atomic Layer Processing (ALP) TAC Chairs: Lenka Zajickova, Central European Institute of Technology, Masaryk University, Czech Republic, lenkaz@physics.muni.cz; Scott Walton, U.S. Naval Research Laboratory, scott.walton@nrl.navy.mil; Craig Outten, Universal Display Corporation, coutten@verizon.net